Every year, the processors in mobile devices are becoming more powerful and at the same time increases their heat. A striking example of this was last year's Snapdragon 810 from Qualcomm. Samsung has altogether abandoned the use of this chipset in their devices. But this year, came Snapdragon 820 on the market, which, as says the manufacturer, is not overheated, as its predecessor. South Korean manufacturer this year decided to use the new chip from Qualcomm in its flagship Galaxy S7 and Galaxy S7 Edge. In most markets will be available with the release Exynos 8890, but in some countries, like the US or China, will sell the model with Snapdragon 820. It seems that so Samsung has decided to hedge.
The new Galaxy S7 and Galaxy S7 Edge producer of the first to use the cooling system with a heat pipe, which diverts and dissipates heat from the processor. Such a decision we have seen in the last flagship from Sony, as well as Lumia 950/950 XL from Microsoft.
Experts believe that this year we are waiting for a lot of smart phones with a similar cooling system. The report states that most manufacturers still tend graphite is used in combination with the metal substrate to dissipate heat better. Some companies prefer software that reduces processor speed when heating. The use of heat pipes was not popular, because their use requires a change in the design and layout inside the enclosure. Also, the manufacturer need to purchase additional equipment for their production.
Analysts believe that with the advent of heat pipes into flagship from Samsung and other manufacturers to the supervision of this method of cooling devices.
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